Peeking into 3D chip structures

Oregon State University stands as a beacon of innovation in semiconductor technology and advanced manufacturing. The university’s dedication to research is shaping the futures of critical industries, including chip manufacturing, biomedical applications, and environmental technologies. At the heart of these advancements are emerging techniques measuring thermal conductivity and additive manufacturing using laser sintering.

Electrical and computer engineering researcher earns best paper award

Zahir Alsulaimawi, a postdoctoral researcher in the School of Electrical Engineering and Computer Science at Oregon State University, received a best paper and presentation award at the Sixth International Conference on Big Data and Artificial Intelligence.

Alsulaimawi, who earned master’s and doctoral degrees in electrical and computer engineering at Oregon State, researches ways to make machine learning models smarter without compromising people’s privacy.

Xiangqi Zhu

Xiangqi Zhu received her B.S. degree in electrical engineering from Shandong University, Jinan, China, in 2013 and her Ph.D. degree in electrical engineering from North Carolina State University, Raleigh, NC, USA, in 2017. Since 2017, she has been working as a researcher with the Power Systems Engineering Center, National Renewable Energy Laboratory, Golden, CO, USA. She is joining EECS as an assistant professor in December 2023.

CDADIC: An innovation powerhouse in analog-digital integrated circuitry

The Center for Design of Analog-Digital Integrated Circuits, a graduated NSF industry/university cooperative research center established in1989, has been a global powerhouse of innovation in the field of analog, RF, and mixed-signal integrated circuits. By engaging with CDADIC, industry partners have early access to pioneering research and to a promising new generation of engineers, enabling them to leverage the university’s investments to multiply their own. Multiple underpinnings make CDADIC a crucial player in analog-digital circuitry.

Unveiling the ALD revolution: Oregon State’s pioneering semiconductor advancements

In the evolving landscape of semiconductor research, atomic layer deposition has emerged as a touchstone for innovation. A thin film deposition technique, in which chemical precursors interact with surfaces in a controlled fashion, ALD enables precise, layer-by-layer assembly of materials at the atomic scale. ALD is experiencing groundbreaking advancements at Oregon State University, where researchers are not only refining traditional ALD techniques but also working to expand applications.

Sieun Chae

Sieun Chae is an assistant professor of electrical and computer engineering at OSU. She received her B.S. in materials science and engineering from Yonsei University in South Korea in 2015 and worked as a research fellow at Korea Research Institute of Chemical Technology (2015-2017). She then received a Ph.D. in materials science and engineering in 2022 from the University of Michigan and moved to Cornell University to complete her postdoctoral research.

Anjan Debnath

Anjan Debnath is an instructor for the EECS online program. He received his B.Sc. in electrical and electronics engineering from Bangladesh University of Engineering & Technology. He obtained his M.Sc. and Ph.D. in electrical and computer engineering, both from Florida International University. Debnath has more than two years of professional experience in power engineering field and more than eight years of teaching experience before joining Oregon State University as an instructor.