Collaborations in atomic layer deposition lead to workforce and next-generation packaging solutions
While it appears that we are nearing the sunset of Moore’s Law, we are still in for some incredible last acts in transistor size reduction and semiconductor manufacturing efficiency. With roots reaching back to the mid-1980s, atomic layer deposition has long been considered a potential route in semiconductor manufacturing that could allow Moore’s Law to continue unabated. The method of ALD sees the depositing of thin films of materials onto surfaces one atomic layer at a time, allowing for better control over film thickness and composition than traditional techniques.