[Eecs-news-links] Hitachi Recruiting: Process Engineer

Batten, Tina tina.batten at oregonstate.edu
Mon Apr 18 13:29:51 PDT 2016


HITACHI HIGH TECHNOLGIES AMERICA, INC.

JOB DESCRIPTION

POSITION TITLE:                Process Engineer I
DEPARTMENT NAME:       SED
REPORTING TO TITLE:      Demo Lab Manager FLSA STATUS (E or N)                   E
EEO CATEGORY:                Professional
JOB STATUS:                        Full-time

GENERAL DESCRIPTION
The Process Engineer I position may be located in Portland, Oregon or Dallas, Texas and supports the business objectives of HTA's Semiconductor Equipment Division (SED).
This positions main objective is to provide process engineering support to SED's various demonstration labs, customer activities, and development programs.  The employee must be willing to travel to Japan for a 1-3 month training assignment if necessary.  This is a developmental position.  Engineer is initially spending approximately 75% of their time in training and under close supervision while typically receiving detailed instructions for most tasks. Position is expected to acquire job skills, learn company policies and procedures, perform routine tasks, enhance process development skills and acquire hardware proficiency.  Continued training will be given to develop specific skills, knowledge and service techniques.  The engineer should be able to independently perform tasks, understand RIE theory, work in a cleanroom environment, and interface with customers on a detailed level within 3 years. The engineer is also interfacing with engineers globally so strong interpersonal skills are required.

Note:  Indicate functions following each responsibility/requirement description: Key:  EEEEssential Functions  NENNNon-Essential Functions

PRIMARY RESPONSIBILITIES
. Day-to-Day responsibilities include: completing assigned tasks in a timely fashion, learning routine development tasks and tool operation, and acquiring specific process development knowledge and skills. {E}
. Hands-on dry etch process development. This includes performing customer demonstrations, R&D of new dry etch technology trends, and meeting the objectives of customer requirements for current and future technology processes.  {E}
. Operate Hitachi Etch System after being trained. {E}
. After training, must be able to operate all associated semiconductor metrology equipment including scanning electron microscopy, focused ion beam milling, and thin film metrology techniques.  {E}
. Working under supervision, must be able to independently complete routine process development tasks after receiving detailed instructions. {E}
. Utilize analytical tools & techniques to solve process development issues. {E}
. Analysis of data, design and execution of experiments including DOE. {E}
. 
Generate internal and external documentation for products, presentations, and technical reports, and generate process engineering specifications. {E}
. Interface with customers regarding demonstration results, new product evaluations, training of process and/or equipment, and troubleshooting of process issues.
. Interface with Hitachi Corporate R&D headquarters in Japan. {E}

EDUCATION, LICENSES, AND/OR CERTIFICATION REQUIREMENTS
. BS Degree in Chemical Engineering, Materials Science, Electrical Engineering, related field, or equivalent experience.
EXPERIENCE AND TRAVEL REQUIREMENTS
. 0-5 years Plasma Etch Process Experience or semiconductor processing preferred.
. Possible travel to Japan for training or customer sites worldwide as needed

SKILLS AND ABILITIES REQUIREMENTS
. Must be willing to travel to Japan for 0-2 year training assignment.
. Periodic oversees business trips may be required throughout the year.
. Candidate must have good verbal and written communication, strong analytical capabilities and trouble shooting skills, and must work well in a team environment.
. Strong general technical knowledge of semiconductor wafer processing.
. Fundamental understanding of and experience with Dry Etch / RIE.
. Self-motivated and show ability to adapt to changes in a fast moving environment.
. Demonstrate project planning, execution, and leadership skills with on-time delivery of milestones.
. Strong engineering analytical/problem solving skills.  Understanding of Scientific Method and experience using it.
. In depth knowledge of Design of Experiments (DOE).
. Ability to work in teams in leadership and subordinate roles.
. Must be able to work in a clean room environment for extended hours.
. Oversee some of the logistics of the demo lab like: tacky mats, LN2 fill, clean room garments pick up and drop off, miscellaneous supply needs, and occasional delivery or pickup of demo lab parts or wafers. {E}
. Research, create and submit purchase orders for materials and services  NEN
. Strong computer skills including Microsoft Office software competency.

SAFETY REQUIREMENTS
. Job Related Knowledge Wire training
. Additional training to handle acids, bases or gases used for dry etching as needed

POSITION - SAFETY RISKS AND HAZARDS
. Gases (toxic and non toxic) and handling of wet chemicals for sample preparation and analysis such as dilute HF

Include any protective equipment that must be worn, e.g., ear protection, safety glasses.
. Clean room attire
. Safety glasses or equivalent
. Chemical gear to handle wet chemicals along with hood operation


Check/Add as needed; indicate codes NOFC (see below)
. Mark all physical and mental requirements that apply

Physical Abilities Lift /Carry
    O     Stand
    O     Walk
    F     Sit
    O     Handling / Fingering
    O     Reach Above Shoulder
    O     Climb or Crawl
    O     Squat or Kneel

Lifting or Moving
        10 lbs or less
        11-20 lbs C
    O     21-50 lbs F
        51-100 lbs
        Over 100 lbs

Push / Pull
        12 lbs or less
        13-25 lbs.
    O     26-40 lbs
        41-100 lbs

Other:
N (Not Applicable) Activity is not applicable to this occupation.
O (Occasionally) Occupation requires this activity up to 33% of the time (0 - 2.5+ hrs/day)
F (Frequently) Occupation requires this activity from 33% - 66% of the time (2.5 - 5.5+ hrs/day)
C (Constantly) Occupation requires this activity more than 66% of the time (5.5+ hrs/day)

The above job description has been designed to indicate the general nature and level of work performed by employees with this classification. It is not designed to contain or be interpreted as a comprehensive inventory of all duties, responsibilities and qualifications required of employees assigned to this job.


From: Cahill, Mark [mailto:Mark.Cahill at hitachi-hta.com] 
Sent: Monday, April 18, 2016 7:31 AM
To: tinab at eecs.oregonstate.edu
Subject: Hitachi Recruiting: Process Engineer
 
Hi Tina,
 
I have been given your contact information by Jenna Robinson in order to help with recruiting at OSU.
 
Hitachi High Technologies America, Inc. is looking to hire for an open Process Engineering position.
I was hoping you could help inform any students who might be interested about the position to help spread awareness.
We are looking for Chemical Engineering, Electrical Engineering, Physics, and Material Science majors.
 
I have attached the job information as a PDF.
The job is already posted on Beaver Careers, where the students can apply: http://career.oregonstate.edu/students/beaver-careers. 
 
I appreciate any help you can provide.
 
Thanks,
Mark
------------------------------------------------
Mark Cahill
Hitachi High Technologies America, Inc.
23235 NW Evergreen Pkwy, Bldg. D
Hillsboro, OR  97124
 



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